This specification covers a filled, room-temperature-polymerizing epoxy resin formulation, supplied as a two-component system.Cancel due to inaccurate technical requirements.


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    Title :

    Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm


    Publication date :

    2016-09-22



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English