Examples are given of the heat treatment residual stress and retained austenite distributions in a carburized part, and the residual stress after grinding in another hardened part. Stress fields around dislocations in silicon wafers due to processing are shown by X-ray topographs, illustrating that residual stresses are also of concern in other materials.


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    Title :

    Residual Stresses in Steel Parts and Single Crystal Silicon


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    1971 Automotive Engineering Congress and Exposition ; 1971



    Publication date :

    1971-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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