Examples are given of the heat treatment residual stress and retained austenite distributions in a carburized part, and the residual stress after grinding in another hardened part. Stress fields around dislocations in silicon wafers due to processing are shown by X-ray topographs, illustrating that residual stresses are also of concern in other materials.


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    Titel :

    Residual Stresses in Steel Parts and Single Crystal Silicon


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Pearson, D. A. (Autor:in)

    Kongress:

    1971 Automotive Engineering Congress and Exposition ; 1971



    Erscheinungsdatum :

    01.02.1971




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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