Organic tin compounds were examined as replacements for the hardening catalyst function of lead in order to produce a lead-free cationic E-coat. The mechanism of the decline in adhesion, at the interface between the anti-chip primer and the primer surfacer, when an organic tin compound migrated to the anti-chip primer layer, was determined. Monobutyl tin compounds were found to have the lowest mobility within the film of organic tin compounds capable of functioning as hardening catalysts. A lead-free E-coat, employing a monobutyl tin compound, demonstrated no decline in adhesion, and the performance of the film was equivalent to that of conventional E-coat.


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    Title :

    Lead Free Cationic Electro-Deposition for Automobile Body in White


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    International Body Engineering Conference & Exposition ; 2003



    Publication date :

    2003-10-27




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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