Organic tin compounds were examined as replacements for the hardening catalyst function of lead in order to produce a lead-free cationic E-coat. The mechanism of the decline in adhesion, at the interface between the anti-chip primer and the primer surfacer, when an organic tin compound migrated to the anti-chip primer layer, was determined. Monobutyl tin compounds were found to have the lowest mobility within the film of organic tin compounds capable of functioning as hardening catalysts. A lead-free E-coat, employing a monobutyl tin compound, demonstrated no decline in adhesion, and the performance of the film was equivalent to that of conventional E-coat.
Lead Free Cationic Electro-Deposition for Automobile Body in White
Sae Technical Papers
International Body Engineering Conference & Exposition ; 2003
27.10.2003
Aufsatz (Konferenz)
Englisch
20037058 2003-01-2783 Lead Free Cationic Electro-Deposition for Automobile Body in White
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|Development of lead free cationic e-coating for automobile body in white
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British Library Conference Proceedings | 2003
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