Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Thermal Physics of Failure


    Additional title:

    Sae Technical Papers


    Contributors:
    Perez, Rigo (author)

    Conference:

    Reliability, Maintainability, Supportability & Logistics (Rmsl) Conference & Workshop ; 1996



    Publication date :

    1996-05-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English


    Keywords :


    Physics-of-failure

    McCluskey, P. | IEEE | 1999


    Physics of Failure

    Jata, Kumar V. / Parthasarathy, Triplicane A. | Wiley | 2011


    The Physics of Failure

    IEEE; Aerospace and Electronics Systems Society | British Library Conference Proceedings | 1999


    Dynamic Physics of Failure

    Perez, Rigo | SAE Technical Papers | 1996


    Microstructural damage metrics for failure physics

    Matic, P. / Everett, R.K. / Geltmacher, A.B. et al. | IEEE | 2002