Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling.
Thermal Physics of Failure
Sae Technical Papers
Reliability, Maintainability, Supportability & Logistics (Rmsl) Conference & Workshop ; 1996
01.05.1996
Aufsatz (Konferenz)
Englisch
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