Temperature changes cause thermo-mechanical stresses and creep in solder joints of electronics. These conditions induce cracking in the solder and eventual failure of the electronic component. This paper describes procedures for predicting the lifetime to failure of electronics exposed to thermal cycling.


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    Titel :

    Thermal Physics of Failure


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Perez, Rigo (Autor:in)

    Kongress:

    Reliability, Maintainability, Supportability & Logistics (Rmsl) Conference & Workshop ; 1996



    Erscheinungsdatum :

    01.05.1996




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


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