Vibration is a major source of failure in electronics. This environment can create repetitive stresses and fatigue in the interconnections of the printed circuit boards and their components. This paper describes procedures for predicting the lifetime to failure of circuit board components exposed to vibration.


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    Titel :

    Dynamic Physics of Failure


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Perez, Rigo (Autor:in)

    Kongress:

    Reliability, Maintainability, Supportability & Logistics (Rmsl) Conference & Workshop ; 1996



    Erscheinungsdatum :

    01.05.1996




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


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    Physics-of-failure

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    Thermal Physics of Failure

    Perez, Rigo | SAE Technical Papers | 1996


    The Physics of Failure

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    Microstructural damage metrics for failure physics

    Matic, P. / Everett, R.K. / Geltmacher, A.B. et al. | IEEE | 2002