Effective use of power integrated circuit packages in automotive systems requires thermal models. This paper provides detailed information on the transient and steady state characterization and modeling of power SOIC packages. Sixteen and twenty four pin wide body SOICs are analyzed in FR4 and polyimide systems. Model extraction, generation, and validation are presented. To validate the model, data taken in an electronic fuel injection system is analyzed and then compared to the simulation results. The model results show 3 % correlation to the actual data.


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    Title :

    Thermal Characterization of Integrated Circuit Packages for Electronic Engine Control


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    International Congress & Exposition ; 1997



    Publication date :

    1997-02-24




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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