Effective use of power integrated circuit packages in automotive systems requires thermal models. This paper provides detailed information on the transient and steady state characterization and modeling of power SOIC packages. Sixteen and twenty four pin wide body SOICs are analyzed in FR4 and polyimide systems. Model extraction, generation, and validation are presented. To validate the model, data taken in an electronic fuel injection system is analyzed and then compared to the simulation results. The model results show 3 % correlation to the actual data.


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    Titel :

    Thermal Characterization of Integrated Circuit Packages for Electronic Engine Control


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Kanner, Jeff (Autor:in) / Wellnitz, Keith (Autor:in)

    Kongress:

    International Congress & Exposition ; 1997



    Erscheinungsdatum :

    1997-02-24




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Thermal characterization of integrated circuit packages for electronic engine control

    Kanner,J. / Wellnitz,K. / Motorola Semiconductor Products Sector,US | Kraftfahrwesen | 1997


    Transient thermal analysis for electronic packages

    CHACKO, M. J. / MANI, LEELAMMA / SHUKLA, K. N. | AIAA | 1987



    Power Integrated Circuits for Electronic Engine Control

    Kanner, Jeff / Wellnitz, Keith | SAE Technical Papers | 1995


    Integrated Engine Control—The Next Step in Electronic Engine Technology

    Laurent, H. / Ang, L. / Daly, P. | SAE Technical Papers | 1984