This paper discusses a variety of manufacturing techniques which have been developed to produce cost effective multilayer interconnects while overcoming the harsh environmental conditions imposed by the Automotive Industry. A comparison is made to the transition of Military Rigid-flex technology and materials needed to overcome the aerospace environment.
Flexible Multilayer Designs Provide Cost Effective Packaging Solutions
Sae Technical Papers
International Congress & Exposition ; 1999
1999-03-01
Conference paper
English
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