This paper discusses a variety of manufacturing techniques which have been developed to produce cost effective multilayer interconnects while overcoming the harsh environmental conditions imposed by the Automotive Industry. A comparison is made to the transition of Military Rigid-flex technology and materials needed to overcome the aerospace environment.


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    Title :

    Flexible Multilayer Designs Provide Cost Effective Packaging Solutions


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    International Congress & Exposition ; 1999



    Publication date :

    1999-03-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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