The stresses produced by the epoxy resin during thermal shock may cause rupture of the component-to-ribbon welds in encapsulated welded modules. This investigation develops a mathematical model describing the stresses on component lead wires. Stresses are functions of the temperature-dependent mechanical properties of the epoxy, diameter of an epoxy slug in shear with the component lead wire, and temperature. Thermal stress indexes were established to predict the thermal-shock properties of epoxies. Strain-gage force-voltage transducers, simulating epoxy-encapsulated, cylindrical, electronic components, were used to measure stresses in modules. Good agreement was obtained between experimental data and theoretical results.
Thermal Stress Analysis of Epoxy Encapsulants
Sae Technical Papers
Electronic Packaging Conference ; 1967
1967-02-01
Conference paper
English
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