The stresses produced by the epoxy resin during thermal shock may cause rupture of the component-to-ribbon welds in encapsulated welded modules. This investigation develops a mathematical model describing the stresses on component lead wires. Stresses are functions of the temperature-dependent mechanical properties of the epoxy, diameter of an epoxy slug in shear with the component lead wire, and temperature. Thermal stress indexes were established to predict the thermal-shock properties of epoxies. Strain-gage force-voltage transducers, simulating epoxy-encapsulated, cylindrical, electronic components, were used to measure stresses in modules. Good agreement was obtained between experimental data and theoretical results.


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    Titel :

    Thermal Stress Analysis of Epoxy Encapsulants


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Electronic Packaging Conference ; 1967



    Erscheinungsdatum :

    01.02.1967




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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