Implantable microdielectric sensors are routinely used to monitor the cure of thermosetting polymers. Until recently, the cure monitoring of Reaction Injection Molding (RIM) processes has been difficult due to the short reaction times of RIM materials in relation to the time required to make the dielectric measurements. New high-speed hardware and software (8.3 milliseconds per measurement) has been developed for the dielectric cure monitoring of RIM systems. Dielectric curing data collected with both the existing and new hardware and software are discussed.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Dielectric Cure Monitoring of Reaction Injection Molding Processes


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    1988 Conference and Exposition on Future Transportation Technology ; 1988



    Publication date :

    1988-08-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Dielectric cure monitoring of reaction injection molding processes

    Shepard,D.D. / Day,D.R. / Lee,H.L. et al. | Automotive engineering | 1988


    Reaction Injection Molding

    Lewis,G.D. / Union Carbide,US | Automotive engineering | 1982


    Reaction Injection Molding

    Lewis, George D. | SAE Technical Papers | 1982


    In-Mold Cure Monitoring of Phenolic Molding Materials

    Shepard, David D. / Smith, Kim R. / Landi, Vincent R. | SAE Technical Papers | 1998


    In-mold cure monitoring of phenolic molding materials

    Landi,V.R. / Shepard,D.D. / Smith,K.R. et al. | Automotive engineering | 1998