Implantable microdielectric sensors are routinely used to monitor the cure of thermosetting polymers. Until recently, the cure monitoring of Reaction Injection Molding (RIM) processes has been difficult due to the short reaction times of RIM materials in relation to the time required to make the dielectric measurements. New high-speed hardware and software (8.3 milliseconds per measurement) has been developed for the dielectric cure monitoring of RIM systems. Dielectric curing data collected with both the existing and new hardware and software are discussed.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Dielectric Cure Monitoring of Reaction Injection Molding Processes


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Shepard, David D. (Autor:in) / Day, David R. (Autor:in) / Lee, Huan L. (Autor:in)

    Kongress:

    1988 Conference and Exposition on Future Transportation Technology ; 1988



    Erscheinungsdatum :

    1988-08-01




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Dielectric cure monitoring of reaction injection molding processes

    Shepard,D.D. / Day,D.R. / Lee,H.L. et al. | Kraftfahrwesen | 1988


    Reaction Injection Molding

    Lewis, George D. | SAE Technical Papers | 1982


    Reaction Injection Molding

    Lewis,G.D. / Union Carbide,US | Kraftfahrwesen | 1982


    In-Mold Cure Monitoring of Phenolic Molding Materials

    Shepard, David D. / Smith, Kim R. / Landi, Vincent R. | SAE Technical Papers | 1998


    In-mold cure monitoring of phenolic molding materials

    Landi,V.R. / Shepard,D.D. / Smith,K.R. et al. | Kraftfahrwesen | 1998