This paper presents a new method of reliability testing for C-MOS VLSI's evaluation, i.e. a means to verify the future reliability prediction. In this method, VLSI's under testing are stressed by soft x-ray irradiation and subsequently annealed at moderate temperature and then they are classified according to the time required to recover the computer action of VLSI's to the previous level. This method offers a new technology for future reliability testing in higher accuracy of C-MOS VLSI's used in automotive electronics system compared to the conventional technique so called burn-in.


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    Title :

    A New Method of Reliability Testing for C-MOS VLSI's Evaluation


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    4th International Pacific Conference on Automotive Engineering ; 1987



    Publication date :

    1987-11-08




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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