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    Title :

    Creep Analysis of Lead-Free Solders Undergoing Thermal Loading


    Published in:

    Publication date :

    2008



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    BKL:    55.60 Raumfahrttechnik / 55.60 / 50.00 / 50.00 Technik allgemein: Allgemeines



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