Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Through Hole Solder Joints


    Contributors:
    Pierce (author)


    Publication date :

    1994



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English



    Classification :

    BKL:    55.54 Flugführung / 53.70 / 55.64 / 55.64 Raumfahrzeugführung / 55.54 / 53.70 Nachrichtentechnik, Kommunikationstechnik: Allgemeines
    Local classification TIB:    770/5650



    Automated inspection of through hole solder joints utilizing X-ray imaging

    Pierce, B.L. / Shelton, D.J. / Longbotham, H.G. et al. | IEEE | 1994


    Compound solder joints

    Batista, R. I. / Simonson, R. B. | NTRS | 1976


    Stress-relieved solder joints

    Zemenick, C. J. | NTRS | 1980



    Magnetic solder to reduce porosity of solder joints formed in microgravity

    Dunkle, Aaron / Itschner, Stephen / Kuhlman, John | Elsevier | 2020