SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Journal of electronics manufacturing ; 8 , 3-4
1998
Article (Journal)
English
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
Online Contents | 1998
|Wafer Applied Underfill - Delivering Flip Chip to the Mainstream
British Library Conference Proceedings | 2002
|Wafer Applied Underfill – Delivering Flip Chip to the Mainstream
SAE Technical Papers | 2002
|Low-cost solder bumping and flip-chip assembly for automotive microsystem applications
Tema Archive | 2003
|