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    Title :

    High density packaging technologies for RF electronics in small spacecraft


    Contributors:

    Publication date :

    2017-03-04


    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English



    High density packaging technologies for RF electronics in small spacecraft

    Aguirre, Fernando / Schatzel, Donald | IEEE | 2017


    Packaging technologies for high temperature electronics in vehicles

    Schuch, B. / Hettich, G. / VDI; Gesellschaft Fahrzeug- und Verkehrstechnik | British Library Conference Proceedings | 1996




    Advanced packaging technologies for automotive electronics

    Sham, Man-Lung / Gao, Ziyang / Leung, L.L.W. et al. | Tema Archive | 2007