Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
2000 IEEE Aerospace COnference
1999-03-18
Conference paper
No indication
English
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
British Library Conference Proceedings | 2000
|CBGA/PBGA Package Planarity and Assembly Reliability
NTRS | 1996
|CBGA/PBGA for Highly Reliable Applications
NTRS | 1996
|Reliability of electronics assemblies
Tema Archive | 1989
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