Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.


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    Title :

    Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies


    Contributors:

    Conference:

    2000 IEEE Aerospace COnference


    Publication date :

    1999-03-18


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English




    Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies

    Ghaffarian, R. / Institute of Electrical and Electronics Engineers | British Library Conference Proceedings | 2000





    Reliability of electronics assemblies

    Hummel, J.E. | Tema Archive | 1989