Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
2000 IEEE Aerospace COnference
18.03.1999
Aufsatz (Konferenz)
Keine Angabe
Englisch
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
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