Submicron metallization has been a mixed blessing.


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    Title :

    Reliability Challenges in Emerging IC Metallization Technologies


    Contributors:
    Lloyd, J. (author)

    Conference:

    ESCCON 2000 European Space Components Conference


    Publication date :

    2000-03-20


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English





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