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    Title :

    High Density Microelectronics Packaging Roadmap for Space Applications


    Contributors:

    Conference:

    IMAPS 2000


    Publication date :

    2000-09-22


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English






    Packaging roadmap

    de Saint Roman, D. / European Space Agency | British Library Conference Proceedings | 2002