The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.


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    Title :

    Microelectronics packaging research directions for aerospace applications


    Contributors:

    Conference:

    SMTA Pan Pacific Microelectronics Symposium


    Publication date :

    2003-02-18


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English




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