This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.


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    Title :

    Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program


    Contributors:

    Conference:

    Government Microcircuits Application Conference ; 2005 ; Las Vegas, NV, United States


    Publication date :

    2005-01-01


    Type of media :

    Preprint


    Type of material :

    No indication


    Language :

    English




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