This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.


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    Titel :

    Risk Management of Microelectronics: The NASA Electronic Parts and Packaging (NEPP) Program


    Beteiligte:

    Kongress:

    Government Microcircuits Application Conference ; 2005 ; Las Vegas, NV, United States


    Erscheinungsdatum :

    01.01.2005


    Medientyp :

    Preprint


    Format :

    Keine Angabe


    Sprache :

    Englisch




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