Several pulsed ultrasonic transducers attached to workpiece for measurement of changes in thicknesses of workpiece at transducer locations during grinding and polishing, according to proposal. Once attached, each transducer remains attached at original position until all grinding and polishing operations complete. In typical application, workpiece glass or ceramic blank destined to become component of optical system.
Measuring Thicknesses With In Situ Ultrasonic Transducers
NASA Tech Briefs ; 19 , 9
1995-09-01
Miscellaneous
No indication
English
Measuring Thicknesses With In Situ Ultrasonic Transducers
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