Several pulsed ultrasonic transducers attached to workpiece for measurement of changes in thicknesses of workpiece at transducer locations during grinding and polishing, according to proposal. Once attached, each transducer remains attached at original position until all grinding and polishing operations complete. In typical application, workpiece glass or ceramic blank destined to become component of optical system.


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    Titel :

    Measuring Thicknesses With In Situ Ultrasonic Transducers


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    01.09.1995



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :



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