Unusual heat treatment heals voids in aluminum interconnections on integrated circuits (IC's). Treatment consists of heating IC to temperature between 200 degrees C and 400 degrees C, holding it at that temperature, and then plunging IC immediately into liquid nitrogen. Typical holding time at evaluated temperature is 30 minutes.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Healing Voids In Interconnections In Integrated Circuits


    Contributors:

    Published in:

    Publication date :

    1989-09-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




    Three-dimensional integrated circuits with optical interconnections [2969-54]

    Kostsov, E. G. / Piskunov, S. V. / St Petersburg State Academy of Aerospace Instrumentation et al. | British Library Conference Proceedings | 1996


    Sources and Circuits for High Performance Smart Pixel-Based Interconnections Optical Interconnections

    IEEE / Lasers and Electro-Optics Society | British Library Conference Proceedings | 1995


    Viewing Integrated-Circuit Interconnections By SEM

    Lawton, Russel A. / Gauldin, Robert E. / Ruiz, Ronald P. | NTRS | 1990


    Free-Space Optical Interconnections for VLSI Circuits: A Technology Roadmap

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1996


    Sources and circuits for high performance smart-pixel based optical interconnections

    Forrest, S.R. / Beyzavi, K. / Shiau, G.-J. et al. | IEEE | 1995