Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.


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    Title :

    Repairable Encapsulated Electronic Modules


    Contributors:

    Published in:

    Publication date :

    1984-12-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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