Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.
Repairable Encapsulated Electronic Modules
NASA Tech Briefs ; 8 , 2
01.12.1984
Sonstige
Keine Angabe
Englisch
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