Two improved cure-in-place silicone-elastomer-based adhesives have low thermal expansion and low thermal conductivity. Adhesives are flexible at low temperature and withstand high temperatures without disintegrating. New ablative compounds were initially developed for in-flight repair of insulating tile on Space Shuttle orbiter. Could find use in other applications requiring high-performance adhesives, such as sealants for solar collectors.


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    Title :

    Improved Cure-in-Place Silicone Adhesives


    Contributors:
    Blevins, C. E. (author) / Sweet, J. (author) / Gonzalez, R. (author)

    Published in:

    Publication date :

    1982-11-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English


    Keywords :


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