Two improved cure-in-place silicone-elastomer-based adhesives have low thermal expansion and low thermal conductivity. Adhesives are flexible at low temperature and withstand high temperatures without disintegrating. New ablative compounds were initially developed for in-flight repair of insulating tile on Space Shuttle orbiter. Could find use in other applications requiring high-performance adhesives, such as sealants for solar collectors.


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    Titel :

    Improved Cure-in-Place Silicone Adhesives


    Beteiligte:
    Blevins, C. E. (Autor:in) / Sweet, J. (Autor:in) / Gonzalez, R. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.11.1982



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    High performance silicone sheet adhesives

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    Development of Electrical/Thermal Silicone Adhesives

    Jugniot, P. / Gomes, S. / Sierra, G. et al. | British Library Conference Proceedings | 2013


    Structural adhesives for rapid cure applications

    Mahoney, C.L. | Tema Archiv | 1979