Report reviews chemical vapor deposition (CVD) for processing integrated circuits and describes fully automatic machine for CVD. CVD proceeds at relatively low temperature, allows wide choice of film compositions (including graded or abruptly changing compositions), and deposits uniform films of controllable thickness at fairly high growth rate. Report gives overview of hardware, reactants, and temperature ranges used with CVD machine.


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    Title :

    Automatic chemical vapor deposition


    Contributors:

    Published in:

    Publication date :

    1981-01-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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