One year study program was divided into three tasks: to identify costs factors involved in packaged electronic subsystems as function of LSI density and reliability; to select most promising factors that might be modified to reduce costs in high-density packaging; and to investigate cost-saving beam tape technology for producing high-volume discrete-device packages. Results are published in 67 page report.


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    Title :

    Cost savings in LSI fabrication


    Contributors:

    Published in:

    Publication date :

    1980-06-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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