One year study program was divided into three tasks: to identify costs factors involved in packaged electronic subsystems as function of LSI density and reliability; to select most promising factors that might be modified to reduce costs in high-density packaging; and to investigate cost-saving beam tape technology for producing high-volume discrete-device packages. Results are published in 67 page report.
Cost savings in LSI fabrication
NASA Tech Briefs ; 4 , 4
1980-06-01
Miscellaneous
No indication
English
Online Contents | 1995
Cost savings through technical innovation
Online Contents | 2014
Online Contents | 2007
Unblocking the channels to cost savings
Online Contents | 2008
Savings increase under unit cost system
Engineering Index Backfile | 1928