One year study program was divided into three tasks: to identify costs factors involved in packaged electronic subsystems as function of LSI density and reliability; to select most promising factors that might be modified to reduce costs in high-density packaging; and to investigate cost-saving beam tape technology for producing high-volume discrete-device packages. Results are published in 67 page report.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Cost savings in LSI fabrication


    Beteiligte:
    Himmel, R. P. (Autor:in) / Salmassy, S. (Autor:in) / Stuhlbarg, S. M. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.06.1980



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Cost savings in tank cleaning

    Online Contents | 1995



    IAC fastened on cost savings

    Online Contents | 2007



    Savings increase under unit cost system

    Engineering Index Backfile | 1928