Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.


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    Title :

    Stitch-bond parallel-gap welding for IC circuits


    Contributors:
    Chvostal, P. (author) / Tuttle, J. (author) / Vanderpool, R. (author)

    Published in:

    Publication date :

    1980-06-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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