Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.


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    Titel :

    Stitch-bond parallel-gap welding for IC circuits


    Beteiligte:
    Chvostal, P. (Autor:in) / Tuttle, J. (Autor:in) / Vanderpool, R. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1980-06-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


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