Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.
Stitch-bond parallel-gap welding for IC circuits
NASA Tech Briefs ; 4 , 4
1980-06-01
Sonstige
Keine Angabe
Englisch
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