Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.
Moisture penetration in microcircuit packages
NASA Tech Briefs ; 4 , 3
1980-04-01
Miscellaneous
No indication
English
NTRS | 1978
|Microcircuit photography technique
NTRS | 1977
|Microcircuit masking techniques
NTRS | 1967
|NTIS | 1970
|Microcircuit Emulation - A Technology Solution
British Library Conference Proceedings | 2001
|