Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.


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    Title :

    Moisture penetration in microcircuit packages


    Contributors:

    Published in:

    Publication date :

    1980-04-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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