Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.
Moisture penetration in microcircuit packages
NASA Tech Briefs ; 4 , 3
01.04.1980
Sonstige
Keine Angabe
Englisch
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