Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.


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    Titel :

    Moisture penetration in microcircuit packages


    Beteiligte:
    Licari, J. J. (Autor:in) / Perkins, K. L. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.04.1980



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




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