Layer of TiO2, economically deposited during integrated circuit fabrication, allows "nonpattern" metal to be removed cleanly.


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    Title :

    Lift-off procedure improves pattern definition


    Contributors:

    Published in:

    Publication date :

    1979-12-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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