The trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.


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    Title :

    Microelectronics/electronic packaging potential


    Contributors:


    Publication date :

    1977-11-01


    Type of media :

    Conference paper


    Type of material :

    No indication


    Language :

    English






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