The trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.
Microelectronics/electronic packaging potential
1977-11-01
Conference paper
No indication
English
NTIS | 1964
|Microelectronics in electronic ignition - status and evolution
Automotive engineering | 1987
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