Report describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.


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    Title :

    Sealing microcircuits with adhesives


    Contributors:

    Published in:

    Publication date :

    1979-03-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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