Report describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.
Sealing microcircuits with adhesives
NASA Tech Briefs ; 3 , 4
1979-03-01
Miscellaneous
No indication
English
Organic adhesives for hybrid microcircuits
NTRS | 1976
|Emerald Group Publishing | 2007
Removing overcoatings from microcircuits
NTRS | 1979
|Coatings for hybrid microcircuits
NTRS | 1980
|Eliminating gold migration in microcircuits
NTRS | 1979
|