Report describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.


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    Titel :

    Sealing microcircuits with adhesives


    Beteiligte:
    Licari, J. J. (Autor:in) / Perkins, K. L. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.03.1979



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Organic adhesives for hybrid microcircuits

    Perkins, K. L. / Licari, J. J. | NTRS | 1976


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    Coatings for hybrid microcircuits

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    The Various Shades of Microcircuits

    Agarwal, S. | NTRS | 2013