Lightweight High-Power Thermoelectric Module Development
1968
126 pages
Report
No indication
English
Circuits , Resistive, Capacitive, & Inductive Components , Physics , Manufacturing Processes & Materials Handling , Semiconductor devices , Thermoelectricity , Modules(Electronics) , Seebeck effect , Lead(Metal) , Tellurium , Diffusion bonding , Metallurgy , Thermal conductivity , Test methods , Life expectancy , Reliability(Electronics) , Manufacturing