The concept of optoelectronic chip on film (OE-COF) packaging is illustrated. An OE film consists of an optical waveguide film on which impedance-matched electrical line anti bump-bonding pads are formed. LSIs and optical devices such as VCSELs and photodiodes are flip-chip bonded onto the OE film using microsolder bumps.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Optoelectronic chip on film (OE-COF) packaging technology


    Contributors:
    Takahara, H. (author) / Koshoubu, N. (author) / Hirata, H. (author) / Ishizawa, S. (author) / Ishibashi, S. (author) / Tsunetsugu, H. (author)


    Publication date :

    1999-01-01


    Size :

    228283 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Optoelectronic Chip on Film (OE-COF) Packaging Technology

    IEEE | British Library Conference Proceedings | 1999


    Optoelectronic Packaging

    Oman, H. | Online Contents | 1997


    Overview of MEMS technology for packaging optoelectronic components

    Wu, M. C. / Optical Society of America | British Library Conference Proceedings | 1998


    Microrobotics in Optoelectronic Packaging

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1993


    Optoelectronic packaging [Book Review]

    Eskelinen, P. | IEEE | 2001

    Free access