The concept of optoelectronic chip on film (OE-COF) packaging is illustrated. An OE film consists of an optical waveguide film on which impedance-matched electrical line anti bump-bonding pads are formed. LSIs and optical devices such as VCSELs and photodiodes are flip-chip bonded onto the OE film using microsolder bumps.
Optoelectronic chip on film (OE-COF) packaging technology
01.01.1999
228283 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Optoelectronic Chip on Film (OE-COF) Packaging Technology
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