The concept of optoelectronic chip on film (OE-COF) packaging is illustrated. An OE film consists of an optical waveguide film on which impedance-matched electrical line anti bump-bonding pads are formed. LSIs and optical devices such as VCSELs and photodiodes are flip-chip bonded onto the OE film using microsolder bumps.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    Optoelectronic chip on film (OE-COF) packaging technology


    Beteiligte:
    Takahara, H. (Autor:in) / Koshoubu, N. (Autor:in) / Hirata, H. (Autor:in) / Ishizawa, S. (Autor:in) / Ishibashi, S. (Autor:in) / Tsunetsugu, H. (Autor:in)


    Erscheinungsdatum :

    01.01.1999


    Format / Umfang :

    228283 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Optoelectronic Chip on Film (OE-COF) Packaging Technology

    IEEE | British Library Conference Proceedings | 1999


    Optoelectronic Packaging

    Oman, H. | Online Contents | 1997


    Overview of MEMS technology for packaging optoelectronic components

    Wu, M. C. / Optical Society of America | British Library Conference Proceedings | 1998


    Optoelectronic Packaging [Book Review]

    Oman, H. | IEEE | 1997

    Freier Zugriff

    Microrobotics in Optoelectronic Packaging

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1993