We have demonstrated the directed assembly of objects ranging in size from 100 nm to 10 /spl mu/m onto electrode arrays fabricated on Si substrates. An example of this technology is shown. This experiment involves the manipulation of plastic beads of various sizes in solution over the chip.
Directed assembly of optoelectronic components using electric fields
1999-01-01
244622 byte
Conference paper
Electronic Resource
English
Directed Assembly of Optoelectronic Components Using Electric Fields
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