We have demonstrated the directed assembly of objects ranging in size from 100 nm to 10 /spl mu/m onto electrode arrays fabricated on Si substrates. An example of this technology is shown. This experiment involves the manipulation of plastic beads of various sizes in solution over the chip.


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    Title :

    Directed assembly of optoelectronic components using electric fields


    Contributors:
    Ackley, D.E. (author) / Edman, C.F. (author) / Gurtner, C. (author) / Formosa, R. (author) / Heller, M.J. (author) / Coleman, J.J. (author)


    Publication date :

    1999-01-01


    Size :

    244622 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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