We have demonstrated the directed assembly of objects ranging in size from 100 nm to 10 /spl mu/m onto electrode arrays fabricated on Si substrates. An example of this technology is shown. This experiment involves the manipulation of plastic beads of various sizes in solution over the chip.


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    Titel :

    Directed assembly of optoelectronic components using electric fields


    Beteiligte:
    Ackley, D.E. (Autor:in) / Edman, C.F. (Autor:in) / Gurtner, C. (Autor:in) / Formosa, R. (Autor:in) / Heller, M.J. (Autor:in) / Coleman, J.J. (Autor:in)


    Erscheinungsdatum :

    01.01.1999


    Format / Umfang :

    244622 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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